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M Umit Atalay Nil Uzun Ayse Guliz Bilgin Altinoz M H FERRI ALIABADI Luo Guoqing DR GIULIANOALLEGRI Wasim Orfali PETER BEARMAN Hisham Tolbah Li Lihua Sunil Bhooshan DR PAUL BRUCE Xue Lingyun Daniel E. Acuna Prof. Dr. Ghanshyam Singh Yahya Kemal BAYKAL Li Dujuan Dr. Pradeep Kumar HE CHUN Dr. Rajiv Kumar View MoreRicky S W LEE
Chair Professor of Mechanical and Aerospace Engine
Electronic Packaging, Nano Technology, Microsystems, Solid M
The Hong Kong University of Science and Technology
Hong Kong
Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. Currently he is Professor of Mechanical and Aerospace Engineering and Director of Center for Advanced Microsystems Packaging at the Hong Kong University of Science & Technology. He also serves as Director of HKUST Shenzhen Electronic Materials & Packaging Laboratory. In addition, Ricky is Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies.
Flip Chip Technologies and Wafer-Level Chip Scale Packaging; Through Silicon Vias (TSV) and 3D Packaging; Passive Alignment of Optical Fibers; LED Packaging and Solid State Lighting; Lead-free Soldering and Solder Joint Reliability; Computational Modeling and Stress Analysis.