Molecular biomimetics: GEPIâ€based biological routes to technology
C Tamerler, D Khatayevich, M Gungormus, T Kacar… - Peptide Science, 2010
Molecular recognition and supramolecular self-assembly of a genetically engineered gold binding peptide on Au {111}
CR So, JL Kulp III, EE Oren, H Zareie, C Tamerler… - Acs Nano, 2009
Probing the molecular mechanisms of quartz-binding peptides
EE Oren, R Notman, IW Kim, JS Evans, TR Walsh… - Langmuir, 2010
Quartz binding peptides as molecular linkers towards fabricating multifunctional micropatterned substrates
T Kacar, J Ray, M Gungormus, EE Oren, C Tamerler… - Advanced Materials, 2009
Biological response on a titanium implant-grade surface functionalized with modular peptides
H Yazici, H Fong, B Wilson, EE Oren, FA Amos… - Acta biomaterialia, 2013
Molecular design of inorganic-binding polypeptides
JS Evans, R Samudrala, TR Walsh, EE Oren… - Mrs Bulletin, 2008
Preparation of lead zirconate by homogeneous precipitation and calcination
EE Oren, E Taspinar, AC Tas - Journal of the American Ceramic Society, 1997
Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
TO Ogurtani, EE Oren - International Journal of Solids and Structures, 2005
Peptide-directed co-assembly of nanoprobes on multimaterial patterned solid surfaces
M Hnilova, CR So, EE Oren, BR Wilson, T Kacar… - Soft Matter, 2012
Single-step fabrication of patterned gold film array by an engineered multi-functional peptide
M Hnilova, D Khatayevich, A Carlson, EE Oren… - Journal of colloid and interface science, 2012
Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects
TO Ogurtani, EE Oren - Journal of Applied Physics, 2001
Solution study of engineered quartz binding peptides using replica exchange molecular dynamics
R Notman, EE Oren, C Tamerler, M Sarikaya… - Biomacromolecules, 2010
Threshold voltage control in organic thin film transistors with dielectric layer modified by a genetically engineered polypeptide
A Dezieck, O Acton, K Leong, EE Oren, H Ma… - Applied Physics Letters, 2010
Electromigration-induced void grain-boundary interactions: The mean time to failure for copper interconnects with bamboo and near-bamboo structures
TO Ogurtani, EE Oren - Journal of applied physics, 2004